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A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Review

Srikanth Rangarajan, Scott Schiffres, Bahgat Sammakia

Engineering 2023, Volume 26, Issue 7,   Pages 185-197 doi: 10.1016/j.eng.2022.10.019

Abstract: Heterogeneous integration (HI) can be at the chip level (a single chip with multiple hotspots), in multi-chipEmbedded cooling eliminates most sequential conduction resistance from the chip to the ambient, unlikeAlthough embedding the cooling solution onto an electronic chip results in a high heat transfer potentialThis manuscript discusses recent advances in embedded cooling, fluid selection considerations, and conventional, immersion, and additive manufacturing-based embedded cooling technologies.

Keywords： Electronic cooling     Embedded cooling     Immersion cooling    

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System-level Pareto frontiers for on-chip thermoelectric coolers

Sevket U. YURUKER, Michael C. FISH, Zhi YANG, Nicholas BALDASARO, Philip BARLETTA, Avram BAR-COHEN, Bao YANG

Frontiers in Energy 2018, Volume 12, Issue 1,   Pages 109-120 doi: 10.1007/s11708-018-0540-8

Abstract: Thermoelectric coolers are among the most promising techniques for dealing with localized on-chip hotlevel Δ ’s that can be achieved for a range of heat fluxes, defining the upper limits of thermoelectric cooling

Keywords： thermoelectric cooling     thermal management     optimization     high flux electronics    

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Revolutionizing heat transport enhancement with liquid metals: Proposal of a new industry of water-free heat exchangers

Haiyan LI, Jing LIU

Frontiers in Energy 2011, Volume 5, Issue 1,   Pages 20-42 doi: 10.1007/s11708-011-0139-9

Abstract: industries, administrating thermal management in power and energy systems, and innovating enhanced coolingA few promising industrial situations, such as heat recovery, chip cooling, thermoelectricity generation

Keywords： water resource     heat transport enhancement     coolant     thermal management     process engineering     energy crisis     chipcooling    

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Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

Frontiers of Mechanical Engineering 2012, Volume 7, Issue 1,   Pages 29-37 doi: 10.1007/s11465-012-0314-7

Abstract: Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chipvibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chipThe flip chip analytical model is revised by considering the influence of spring mass on mechanical energyThis revised model is then applied to estimate the flip chip resonance frequencies.Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection

Keywords： flip chip     defect detection     ultrasonic excitation     vibration analysis    

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Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

Frontiers of Mechanical Engineering 2013, Volume 8, Issue 2,   Pages 118-126 doi: 10.1007/s11465-013-0253-y

Abstract:

To enhance the performance of high speed transfer system of LED chip sorting equipment, its control

Keywords： LED chip sorter     multi-domain modeling and simulation     parameter optimization     modelica language    

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Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 581-590 doi: 10.1007/s11465-017-0454-x

Abstract:

This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set

Keywords： electric field microsensor     three-dimensional     single-chip     in-plane rotation    

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Study on forced air convection cooling for electronic assemblies

LI Bin, TAO Wenquan, HE Yaling

Frontiers in Energy 2008, Volume 2, Issue 2,   Pages 158-163 doi: 10.1007/s11708-008-0009-2

Abstract: The slotted fin concept was employed to improve the air cooling performance of plate-fin in heat sinksThe limit of cooling capacity for air-cooling techniques was also addressed.

Keywords： concept     slotted     air-cooling     Preliminary computation     generation    

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Energy efficiency of small buildings with smart cooling system in the summer

Yazdan DANESHVAR, Majid SABZEHPARVAR, Seyed Amir Hossein HASHEMI

Frontiers in Energy 2022, Volume 16, Issue 4,   Pages 651-660 doi: 10.1007/s11708-020-0699-7

Abstract: In this paper, a novel cooling control strategy as part of the smart energy system that can balance thermalFor this goal, a general form of a building was coupled by the smart cooling system (SCS) and the consumptionof energy with thermal comfort cooling of persons simulated by using the EnergyPlus software and comparedthermal comfort temperature was used in accordance with the BMI of persons, it can save up to 35% of the cooling

Keywords： smart home     heating and cooling systems     saving energy     optimal consumption of energy    

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Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 4,   Pages 472-472 doi: 10.1007/s11465-009-0077-y

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SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS

Frontiers of Agricultural Science and Engineering 2023, Volume 10, Issue 3,   Pages 448-457 doi: 10.15302/J-FASE-2023490

Abstract:

● Low-value biowaste including wood chip and potato peel was valorized

Keywords： Aspen Plus     co-gasification     potato peel     syngas     simulation     waste reduction     wood chip    

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A concept of capillary active, dynamic insulation integrated with heating, cooling and ventilation, air

Mark BOMBERG

Frontiers of Structural and Civil Engineering 2010, Volume 4, Issue 4,   Pages 431-437 doi: 10.1007/s11709-010-0071-9

Abstract: This happens when such insulation is integrated with heating, cooling and ventilation, air conditioning

Keywords： capillary active insulation     integrated heating     cooling and ventilation     air conditioning (HVAC) and building    

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evaluation of an improved biomass-fired cogeneration system simultaneously using extraction steam, cooling

Frontiers in Energy 2022, Volume 16, Issue 2,   Pages 321-335 doi: 10.1007/s11708-021-0741-4

Abstract: of the traditional single heat source (extraction steam), the extraction steam from the turbine, the cooling

Keywords： biomass-fired cogeneration     district heat production system     absorption heat pump     extraction steam     cooling    

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3D finite element prediction of chip flow, burr formation, and cutting forces in micro end-milling of

A. DAVOUDINEJAD, P. PARENTI, M. ANNONI

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 2,   Pages 203-214 doi: 10.1007/s11465-017-0421-6

Abstract: simulations were performed under different cutting conditions to obtain realistic numerical predictions of chipnotable advantages, such as capability to easily handle any type of tool geometry and any side effect on chipThe proposed 3D FE model considers the effects of mill helix angle and cutting edge radius on the chip

Keywords： 3D finite element modeling     micro end-milling     cutting force     chip formation     burr formation    

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A comprehensive energy solution for households employing a micro combined cooling, heating and power

Huayi ZHANG, Can ZHANG, Fushuan WEN, Yan XU

Frontiers in Energy 2018, Volume 12, Issue 4,   Pages 582-590 doi: 10.1007/s11708-018-0592-9

Abstract:

In recent years, micro combined cooling, heating and power generation (mCCHP) systems have attractedThe input energy of a mCCHP system is natural gas, while the outputs include heating, cooling and electricity

Keywords： energy hub     micro combined cooling     heating and power generation (mCCHP)     thermal comfort     robust optimization    

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Indoor thermal comfort research on the hybrid system of radiant cooling and dedicated outdoor air system

Weiliang WANG, Zhe TIAN

Frontiers in Energy 2013, Volume 7, Issue 2,   Pages 155-160 doi: 10.1007/s11708-013-0244-z

Abstract: The radiant cooling system generally operates with the dedicated outdoor air system (DOAS).

Keywords： radiant cooling system     dedicated outdoor air system (DOAS)     thermal comfort     Taguchi method     variance analysis    

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Title Author Date Type Operation

A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated

Srikanth Rangarajan, Scott Schiffres, Bahgat Sammakia

Journal Article

System-level Pareto frontiers for on-chip thermoelectric coolers

Sevket U. YURUKER, Michael C. FISH, Zhi YANG, Nicholas BALDASARO, Philip BARLETTA, Avram BAR-COHEN, Bao YANG

Journal Article

Revolutionizing heat transport enhancement with liquid metals: Proposal of a new industry of water-free heat exchangers

Haiyan LI, Jing LIU

Journal Article

Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

Journal Article

Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

Journal Article

Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

Journal Article

Study on forced air convection cooling for electronic assemblies

LI Bin, TAO Wenquan, HE Yaling

Journal Article

Energy efficiency of small buildings with smart cooling system in the summer

Yazdan DANESHVAR, Majid SABZEHPARVAR, Seyed Amir Hossein HASHEMI

Journal Article

Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

Journal Article

SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS

Journal Article

A concept of capillary active, dynamic insulation integrated with heating, cooling and ventilation, air

Mark BOMBERG

Journal Article

evaluation of an improved biomass-fired cogeneration system simultaneously using extraction steam, cooling

Journal Article

3D finite element prediction of chip flow, burr formation, and cutting forces in micro end-milling of

A. DAVOUDINEJAD, P. PARENTI, M. ANNONI

Journal Article

A comprehensive energy solution for households employing a micro combined cooling, heating and power

Huayi ZHANG, Can ZHANG, Fushuan WEN, Yan XU

Journal Article

Indoor thermal comfort research on the hybrid system of radiant cooling and dedicated outdoor air system

Weiliang WANG, Zhe TIAN

Journal Article